Job Information
Intel PBG Advanced Packaging Competitive Lead in Phoenix, Arizona
Job Details:
Job Description:
About FS Packaging and Test Business Group: Packaging is a critical revenue enabler for FS and a key part of Intel's forward-looking strategy. IFS Packaging Test Business Group has been created to develop, grow, and execute a robust packaging roadmap.
About the role: As advanced packaging continues to grow in importance, ensuring that PBG can offer leading advanced packaging solutions across 2D, 2.5D/3.5D, and 3D is critical. This role will be responsible for leading the ongoing analysis of the IFS Advanced Packaging roadmap vs external competitive offerings and providing regular updates to both PBG and ATTD management.
The role requires close collaboration with ATTD partners to understand internal offerings and review external research on third-party developments to ensure that PBG creates and maintains an industry-leading portfolio.
Responsibilities include but not limited to:
Work with TD partners to ensure the TD roadmap is aligned with competitor offerings and suggest roadmap adjustments.
Create competitive benchmarking slides to illustrate Intel's packaging offerings vs key competitorsMonitor market trends and advise packaging strategy adjustments based on market trends.
Partner with Front-End team in IFS to ensure that 2.5D / 3D / 3.5D solutions maximize internal base-die benefits
Qualifications:
You must possess the below minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
*Minimum Qualifications: *
Bachelor’s Degree with 9+ years of experience, OR Master’s Degree with 6+ years of experience, OR PHD in Computer Engineering, Electrical Engineering, Physics, Chemistry, or other related field, with 4+ years of experience in semiconductor packaging and customer engagement.
2+ years of experience in customer and client services at a senior management level, including regularly providing strategic recommendations to Intel VPs and Corporate VPs, with proven track record of effectively presenting insights and proposals to senior management, ensuring alignment with organizational goals, and fostering strong executive relationships.
2+ years of experience presenting insights and recommendations to senior management, including VPs and Corporate VPs.
Preferred Qualifications:
Analyzing and integrating key attributes of 2D, 2.5D/3.5D, and 3D architectures from a customer perspective, including benchmarking against external plans and recommending changes to enhance design effectiveness and customer satisfaction.
Master’s degree or PhD degree in Engineering or an MBA.
Evaluating the external packaging landscape and identifying key competitors, enhancing competitive positioning and market strategy.
Analyzing packaging architectures and respective product attributes, contributing to informed decision-making and strategic development.
Developing and applying mental models of value creation specific to packaging services and products, with a focus on strategic planning and execution.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
Virtual US
Additional Locations:
Business group:
Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://jobs.intel.com/en/benefits
Annual Salary Range for jobs which could be performed in the US:
$179,880.00-$253,940.00
S al ary range dependent on a number of factors including location and experience.
Work Model for this Role
This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
The application window for this job posting is expected to end by 04/04/2025