Job Information
Qualcomm PMIC PDN Engineer in Hsinchu City, Taiwan
Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
Qualcomm Overview:
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.
General Summary:
The Qualcomm Package Electrical Team has an opening in the areas of Power Integrity. The candidate will work with Package and IC designers to find ways to optimize the overall package design. The candidate will be responsible for executing Power integrity solutions for various PMICs. The candidate will be expected to communicate and conduct reviews with PMIC design lead. The candidate will perform Power Integrity simulations in PMIC modules and ensure that they met the VRM requirements. The candidate’s responsibility is working with substrate designers to make sure PDN system level constraints are met prior to the package Tape-out. This position offers the opportunity to work across multiple organizations such as PMIC team, Board team and System PDN team and providing timely feedback to the team is essential.
The responsibilities will include but not be limited to the following:
Perform Power Integrity simulations at Pre-layout and Post layout design phases.
Analyze Power Delivery Network on Interposer and Substrate.
Provide technical support and debug while troubleshooting PMIC Package and Module.
Perform package extraction for the time domain and frequency domain analysis.
Provide design guidelines for the PMIC Package design.
Experiences in DDR, SerDes, LSIO & Mixed signal interfaces are plus.
Minimum Qualifications:
BS and a minimum of 2 years of relevant industry experience
Experience in Power delivery model extraction and analyze PDN data in frequency and time domain for different types of IC Packages.
Solid understanding of System Power distribution network and power supply architecture covering package design technologies and trade-offs.
Experience in Electromagnetics and solid background on transmission line theory & Crosstalk.
Experience working with Product Package design and analysis.
Experience in simulation tools such as ADS and Hspice.
Preferred Qualifications:
MS with 12 years of industry experience is preferred, but fresh MS graduate will be considered
Experience in modeling and analysis of Product Power supply solution including PKG, PCB & VRM.
Experience in EM Field-Solvers such as HFSS, Q3D, Sentinel-PSI, RH-CPA and Clarity.
Experience with PDN Impedance Modeling of 2.5D and 3D IC Packaging.
Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition.
Experience in analyzing LPDDR and SerDes such as PCIe, UFS, USB and MIPI is a plus.
Experience in Matlab , Programming language(c/c++) or scripting language (Perl/Python) skill is a strong plus .
Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail myhr.support@qualcomm.com or call Qualcomm's toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr_public_article_view&sysparm_article=KB0039028) . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities.
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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification